Proceedings of the International Conference on Artificial Intelligence Applications in Business Administration in MENA Region (ICAIABA 2026)

International Conference on Artificial Intelligence Applications in Business Administration in MENA Region (ICAIABA 2026)

📍Biskra, Algeria🗓️ 13-14 April 2026

AI-Driven R&D Cost Reduction in Semiconductor Design: A Silvaco Case Study of Advanced Si:Sb-Bi/Al₂O₃ Devices

Authors
Azzeddine Charef1, *, Amira Sbaihi2, Chaima Benbrika2, Hamza Trir2, Yacine Aoun2, Said Benramache2, Khattra Mimouni1
1Oran 1 ahemed ben bella University, Senia, 31000, Algeria
2Mohamed Khaidher University, Biska, 07000, Algeria
*Corresponding author. Email: azzeddine.charef@univ-biskra.dz
Corresponding Author
Azzeddine Charef
Available Online 24 June 2026.
DOI
10.2991/978-94-6239-711-8_33How to use a DOI?
Keywords
AI-Augmented Simulation; Silvaco TCAD; Si:Sb-Bi/Al2O3 Devices; R&D Cost Optimization; Heavy Doping Engineering; Semiconductor Manufacturing
Abstract

This work reports a computational optimization study of heavily doped (10⁻³) Si:Sb–Bi/Al₂O₃ heterostructures using AI-enhanced Silvaco TCAD simulations to address key material design trade-offs. A central challenge in this system arises from the inverse relationship between beneficial lattice strain and electronic transport performance. Baseline simulations indicate that although full bismuth incorporation (x = 1.0) produces a maximum compressive strain of 0.70%, it also causes a severe degradation in carrier transport, reducing the effective electron mobility to 80 cm² V⁻¹ s⁻¹ and increasing the interface trap density (D_it) to 2.5 × 10¹² cm⁻² eV⁻¹ as a result of pronounced ionized impurity scattering and defect clustering. To overcome this limitation without extensive experimental trial-and-error, a multivariable machine-learning optimization framework was embedded directly into the TCAD simulation flow. The AI-driven analysis identified an optimal stoichiometric “sweet spot” at a bismuth fraction of approximately x ≈ 0.35. This configuration achieved a balanced trade-off, restoring the carrier mobility to 112 cm² V⁻¹ s⁻¹ (a 40% improvement over the fully doped case), while maintaining a high active carrier concentration of 9.1 × 10¹⁹ cm⁻³ and suppressing inter-face defect densities to a manageable level of 5.8 × 10¹¹ cm⁻² eV⁻¹. From a tech-no-economic standpoint, the proposed simulation-to-fabrication methodology significantly improves development efficiency. The AI-guided workflow effectively replaces approximately thirteen iterative experimental fabrication cycles, leading to an estimated 66% reduction in R&D time-to-market and an overall development cost reduction of about 75%, thereby demonstrating the strong potential of this approach for cost-effective and competitive semiconductor device design.

Copyright
© 2026 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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Volume Title
Proceedings of the International Conference on Artificial Intelligence Applications in Business Administration in MENA Region (ICAIABA 2026)
Series
Advances in Economics, Business and Management Research
Publication Date
24 June 2026
ISBN
978-94-6239-711-8
ISSN
2352-5428
DOI
10.2991/978-94-6239-711-8_33How to use a DOI?
Copyright
© 2026 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

Cite this article

TY  - CONF
AU  - Azzeddine Charef
AU  - Amira Sbaihi
AU  - Chaima Benbrika
AU  - Hamza Trir
AU  - Yacine Aoun
AU  - Said Benramache
AU  - Khattra Mimouni
PY  - 2026
DA  - 2026/06/24
TI  - AI-Driven R&D Cost Reduction in Semiconductor Design: A Silvaco Case Study of Advanced Si:Sb-Bi/Al₂O₃ Devices
BT  - Proceedings of the International Conference on Artificial Intelligence Applications in Business Administration in MENA Region (ICAIABA 2026)
PB  - Atlantis Press
SP  - 356
EP  - 364
SN  - 2352-5428
UR  - https://doi.org/10.2991/978-94-6239-711-8_33
DO  - 10.2991/978-94-6239-711-8_33
ID  - Charef2026
ER  -