Proceedings of the 2026 11th International Conference on Financial Innovation and Economic Development (ICFIED 2026)

Restructuring of Supply Chains Amid De-Globalization: A Case Study of the Semiconductor Industry

Authors
Yuxuan Hong1, *
1Law School of Zhejiang University of Finance & Economics, Zhejiang University of Finance & Economics, 18 Xueyuan Street, Xiasha Higher Education Zone, Hangzhou City, Zhejiang, China
*Corresponding author. Email: 18157788812@163.com
Corresponding Author
Yuxuan Hong
Available Online 29 April 2026.
DOI
10.2991/978-94-6239-642-5_51How to use a DOI?
Keywords
De-Globalization; Semiconductor Supply Chain; Supply Chain Restructuring
Abstract

Against the backdrop of de-globalization, the global semiconductor supply chain is undergoing profound restructuring. This paper establishes a “geography-technology” dual-dimensional analytical framework, and systematically examines the driving mechanisms, practical dilemmas, and China’s breakthrough paths of this round of restructuring by integrating theoretical analysis with multi-case comparisons. The findings are as follows: First, trade protectionism, the excessive expansion of security concerns, and crisis shocks are driving the supply chain logic to shift from “efficiency first” to “security first.” The regionalized layout characterized by localization, nearshoring, and friendshoring has led to the “fragmentation” of the global market. Second, although the aggressive industrial policies of major economies such as the United States, the European Union, Japan, and South Korea aim to promote supply chain reshoring and alliance-building, they have intensified technological blockades and resource misallocation—while enhancing regional security, they have significantly increased costs across the industry. Finally, although China has established a policy framework for breakthroughs across the entire industrial chain, it still faces severe chokepoint constraints in advanced process equipment, core materials, and high-end talents, making the path to self-reliant and secure development extremely challenging. This study not only reveals the complex interaction between geopolitics and economic laws in this round of supply chain restructuring but also provides decision-making references for China to formulate precise industrial breakthrough strategies under the new global competitive pattern.

Copyright
© 2026 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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Volume Title
Proceedings of the 2026 11th International Conference on Financial Innovation and Economic Development (ICFIED 2026)
Series
Advances in Economics, Business and Management Research
Publication Date
29 April 2026
ISBN
978-94-6239-642-5
ISSN
2352-5428
DOI
10.2991/978-94-6239-642-5_51How to use a DOI?
Copyright
© 2026 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

Cite this article

TY  - CONF
AU  - Yuxuan Hong
PY  - 2026
DA  - 2026/04/29
TI  - Restructuring of Supply Chains Amid De-Globalization: A Case Study of the Semiconductor Industry
BT  - Proceedings of the 2026 11th International Conference on Financial Innovation and Economic Development (ICFIED 2026)
PB  - Atlantis Press
SP  - 531
EP  - 540
SN  - 2352-5428
UR  - https://doi.org/10.2991/978-94-6239-642-5_51
DO  - 10.2991/978-94-6239-642-5_51
ID  - Hong2026
ER  -