Optimization of TLP Diffusion Bonding Parameters for Joining AA2219 and Ti-6Al-4V with Copper as Interlayer Using RSM-BBD Method

Manjunath Vatnalmath; Virupaxi Auradi; V. Bharath; Madeva Nagaral

doi:10.2991/978-94-6239-813-9_2

<Previous Article In Volume

Next Article In Volume>

Optimization of TLP Diffusion Bonding Parameters for Joining AA2219 and Ti-6Al-4V with Copper as Interlayer Using RSM-BBD Method

Authors

Manjunath Vatnalmath¹^{, *}, Virupaxi Auradi², V. Bharath¹, Madeva Nagaral³

¹Department of Mechanical Engineering, RNS Institute of Technology, Bengaluru, Karnataka, India, 560098

²Department of Mechanical Engineering, Siddaganga Institute of Technology, Tumakuru, Karnataka, India, 572103

³Aircraft Research and Design Centre, Hindustan Aeronautics Limited, Bangalore, Karnataka, 560037, India

^*Corresponding author. Email: manjunathvatnalmath@rnsit.ac.in

Corresponding Author

Manjunath Vatnalmath

Available Online 29 October 2026.

DOI: 10.2991/978-94-6239-813-9_2 How to use a DOI?
Keywords: TLP; RSM-BBD; Intermetallic
Abstract: The transient liquid phase (TLP) diffusion bonding is carried out using the Box Behnken design matrix, and the bonding parameters such as temperature, pressure and holding time have been optimized using the desirability function. The diffusion bonded joints are studied for their microstructure, intermetallic formation, hardness, and joint strength for various bonding parameters. In addition, the effect of bonding parameters on these important properties has been noted. The transient liquid phase (TLP) diffusion bonding of AA2219 and Ti-6Al-4V utilizing a copper interlayer was statistically evaluated and optimized using a Box-Behnken Design coupled with Response Surface Methodology (BBD-RSM).
Copyright: © 2026 The Author(s)
Open Access: Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

Download article (PDF)

<Previous Article In Volume

Next Article In Volume>

Volume Title: Proceedings of the Global Symposium on Adaptive Manufacturing (GSAM 2026)
Series: Advances in Engineering Research
Publication Date: 29 October 2026
ISBN: 978-94-6239-813-9
ISSN: 2352-5401
DOI: 10.2991/978-94-6239-813-9_2 How to use a DOI?
Open Access: Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

Cite this article

ris enw bib

TY  - CONF
AU  - Manjunath Vatnalmath
AU  - Virupaxi Auradi
AU  - V. Bharath
AU  - Madeva Nagaral
PY  - 2026
DA  - 2026/10/29
TI  - Optimization of TLP Diffusion Bonding Parameters for Joining AA2219 and Ti-6Al-4V with Copper as Interlayer Using RSM-BBD Method
BT  - Proceedings of the  Global Symposium on Adaptive Manufacturing (GSAM 2026)
PB  - Atlantis Press
SP  - 4
EP  - 6
SN  - 2352-5401
UR  - https://doi.org/10.2991/978-94-6239-813-9_2
DO  - 10.2991/978-94-6239-813-9_2
ID  - Vatnalmath2026
ER  -

download .riscopy to clipboard