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Peer-Review Statements
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*Corresponding author.
Email: sebastian.uppapalli@mahindrauniversity.edu.in
Corresponding Author
Sebastian Uppapalli
Available Online 4 September 2026.
- DOI
- 10.2991/978-94-6239-764-4_1How to use a DOI?
- Abstract
All of the articles in this proceedings volume have been presented at the International Conference on Mechanics, Materials and Mechatronics during 23rd -25th March 2026 in Hyderabad, India. These articles have been peer reviewed by the members of the Technical Committee and approved by the Editor-in-Chief, who affirms that this document is a truthful description of the conference’s review process.
- Copyright
- © 2026 The Author(s)
- Open Access
- Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.
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TY - CONF AU - Sebastian Uppapalli AU - Debasis Chakraborty PY - 2026 DA - 2026/09/04 TI - Peer-Review Statements BT - Proceedings of the International Conference on Mechanics, Materials and Mechatronics (ICM³ 2026) PB - Atlantis Press SP - 1 EP - 3 SN - 2589-4943 UR - https://doi.org/10.2991/978-94-6239-764-4_1 DO - 10.2991/978-94-6239-764-4_1 ID - Uppapalli2026 ER -