Proceedings of the 2026 2nd International Conference on Education Research and Training Technologies (ERTT 2026)

2026 2nd International Conference on Education Research and Training Technologies (ERTT 2026)

📍Xi'an, China🗓️ 11-13 September 2026

Exploration and Practice on the High-End Skilled Talent Cultivation Model of Integrated Circuits with the Characteristic of “One Achievement per Student for Domestic Chips Application”

Authors
Yongxue Wang1, *, Weiqiang Wu1, Changbin Li1
1School of Integrated Circuits, Shenzhen Polytechnic University, Shenzhen, 518055, Guangdong Province, People’s Republic of China
*Corresponding author. Email: wangyongxue@szpu.edu.cn
Corresponding Author
Yongxue Wang
Available Online 30 October 2026.
DOI
10.2991/978-2-38476-628-4_5How to use a DOI?
Keywords
Domestic Chips Application; One Achievement per Student; integrated circuits; high-end skilled talent; industry-education integration
Abstract

Against the backdrop of the in-depth implementation of the national semiconductor independent innovation strategy and the high-quality development of the integrated circuit industry in the Guangdong-Hong Kong-Macao Greater Bay Area, technological bottlenecks in IC core technologies and the shortage of high-end skilled talents has become increasingly prominent. Positioned within vocational undergraduate education, the School of Integrated Circuits, Shenzhen Polytechnic University, closely focuses on industrial demands and innovatively adopts the talent cultivation model of “One Achievement per Student for Domestic Chips Application”. Through constructing a whole-industry-chain cultivation system, optimizing the curriculum framework, deepening industry-education integration, strengthening practical and innovative training, and building characteristic industrial platforms, the School addresses the mismatch between conventional talent cultivation schemes and actual industrial talent demands, and explores a cultivation path for high-end skilled talent tailored to the development of the domestic chips industry. Based on the School’s practical experience, this paper elaborates on the construction logic, implementation measures and practical effects of the model, and provides valuable references and inspiration for the cultivation of IC skilled talent in vocational education.

Copyright
© 2026 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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Volume Title
Proceedings of the 2026 2nd International Conference on Education Research and Training Technologies (ERTT 2026)
Series
Advances in Social Science, Education and Humanities Research
Publication Date
30 October 2026
ISBN
978-2-38476-628-4
ISSN
2352-5398
DOI
10.2991/978-2-38476-628-4_5How to use a DOI?
Copyright
© 2026 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

Cite this article

TY  - CONF
AU  - Yongxue Wang
AU  - Weiqiang Wu
AU  - Changbin Li
PY  - 2026
DA  - 2026/10/30
TI  - Exploration and Practice on the High-End Skilled Talent Cultivation Model of Integrated Circuits with the Characteristic of “One Achievement per Student for Domestic Chips Application”
BT  - Proceedings of the 2026 2nd International Conference on Education Research and Training Technologies (ERTT 2026)
PB  - Atlantis Press
SP  - 42
EP  - 53
SN  - 2352-5398
UR  - https://doi.org/10.2991/978-2-38476-628-4_5
DO  - 10.2991/978-2-38476-628-4_5
ID  - Wang2026
ER  -