Integrated Circuit Heterogeneous Manufacturing Technology

DOI

10.2991/978-94-6463-986-5_13How to use a DOI?

Keywords

Integrated circuit heterogeneous manufacturing technology; Fan-out wafer-level packaging; 2.5D and 3D packaging

Abstract

Traditional integrated circuit technology attempts to integrate all functions into a single chip, this leads to the chip becoming more expensive and larger. Heterogeneous integration technology solves this problem by combining chips with different processes and technologies. This technology can continuously increase the functional density and reduce the cost of each function to ensure continuous progress in electronics in terms of cost and performance. Heterogeneous integration technology that integrates different types of chips is crucial for achieving higher performance, lower latency, smaller size, lighter weight, lower power consumption requirements, and lower cost, and is also key to continuing Moore’s Law in the post-Moore era. Among them, fan-out wafer-level packaging (FOWLP) and 2.5D/3D packaging have become important technical routes in advanced packaging. This paper reviews the current development status of these two technologies: FOWLP technology uses a fan-out wiring structure to achieve high-density interconnection by forming a redistribution layer (RDL) around the chip; 2.5D packaging mainly uses silicon interlayers or organic interlayers to achieve interconnections between chips, while 3D packaging achieves vertical stacking of chips through through-silicon vias (TSV) technology. The article details the characteristics and key technologies of these three technologies and analyzes the implementation level and industrial application status.

Copyright

© 2026 The Author(s)

Open Access

Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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TY  - CONF
AU  - Yuxin Li
AU  - Zihan Shen
PY  - 2026
DA  - 2026/02/18
TI  - Integrated Circuit Heterogeneous Manufacturing Technology
BT  - Proceedings of the 2025 International Conference on Electronics, Electrical and Grid Technology (ICEEGT 2025)
PB  - Atlantis Press
SP  - 109
EP  - 119
SN  - 2352-5401
UR  - https://doi.org/10.2991/978-94-6463-986-5_13
DO  - 10.2991/978-94-6463-986-5_13
ID  - Li2026
ER  -