The Application of Semiconductor Manufacturing Technology in 6G Communication Technology

DOI

10.2991/978-94-6463-986-5_73How to use a DOI?

Keywords

Semiconductor manufacturing technology; 6G communication technology; Terahertz devices; Three-dimensional packaging; Smart metasurface

Abstract

With the accelerated evolution of communication technology towards 6G, the importance of semiconductor manufacturing technology as the foundation supporting core 6G functions such as terahertz communication and intelligent metasurfaces has become increasingly prominent. This paper systematically reviews the development of semiconductor manufacturing technology, with a focus on the innovative applications of key processes such as lithography, etching, and packaging in 6G RF front-end, very large-scale baseband chips, and quantum communication devices. The research shows that advanced processes such as high k dielectric/metal gate, strain engineering and three-dimensional heterogeneous integration significantly increase the operating frequency of terahertz devices (>800 GHz), the response speed of intelligent metasurfaces (<10 μs), and the computing power density of baseband chips (>20 TOPS/mm2). At the same time, the 6G-specific challenges such as quantum effects of nanoscale processes, atomic-level precision manufacturing of terahertz devices, and industrialization of third-generation semiconductor materials were explored, and strategies such as two-dimensional material integration, low-temperature process development, and intelligent green manufacturing were proposed to address future demands. This paper aims to provide theoretical support for collaborative innovation in semiconductor processes for 6G communication systems.

Copyright

© 2026 The Author(s)

Open Access

Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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TY  - CONF
AU  - Ruiqi Yang
PY  - 2026
DA  - 2026/02/18
TI  - The Application of Semiconductor Manufacturing Technology in 6G Communication Technology
BT  - Proceedings of the 2025 International Conference on Electronics, Electrical and Grid Technology (ICEEGT 2025)
PB  - Atlantis Press
SP  - 719
EP  - 727
SN  - 2352-5401
UR  - https://doi.org/10.2991/978-94-6463-986-5_73
DO  - 10.2991/978-94-6463-986-5_73
ID  - Yang2026
ER  -