Research on the Polishing Technology of Diamond Semiconductor Substrate Material

DOI

10.2991/978-94-6463-986-5_20How to use a DOI?

Keywords

Semiconductor substrate materials; Diamond; Diamond polishing technology

Abstract

This paper primarily examines three distinct diamond polishing techniques: mechanical polishing, thermal chemical polishing, and laser polishing. As the demand for high-performance diamond semiconductors grows in advanced electronics and optics, efficient and precise polishing methods have become critical to achieving optimal material performance. A comprehensive comparison of these techniques is essential to address the trade-offs between processing efficiency, surface quality, and cost, thereby advancing diamond-based applications in extreme environments. The study analyzes the advantages and disadvantages of these techniques and provides guidance on selecting the most suitable method. Diamond is a crucial semiconductor material; however, its high hardness makes it challenging to process and polish. Different polishing techniques are required for diamonds of different shapes. Mechanical polishing is simple and efficient but can damage the sub-surface of the diamond at high speeds. Laser polishing has achieved significant success in precise polishing, but the difficulty in controlling laser energy can lead to damage or loss. Thermal chemical polishing can produce low-damage surfaces with high removal efficiency, but its complex equipment and environmental limitations restrict its application.

Copyright

© 2026 The Author(s)

Open Access

Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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TY  - CONF
AU  - Kunpeng Zhang
PY  - 2026
DA  - 2026/02/18
TI  - Research on the Polishing Technology of Diamond Semiconductor Substrate Material
BT  - Proceedings of the 2025 International Conference on Electronics, Electrical and Grid Technology (ICEEGT 2025)
PB  - Atlantis Press
SP  - 176
EP  - 182
SN  - 2352-5401
UR  - https://doi.org/10.2991/978-94-6463-986-5_20
DO  - 10.2991/978-94-6463-986-5_20
ID  - Zhang2026
ER  -