Proceedings of the 2025 International Conference on Financial Innovation and Marketing Management (FIMM 2025)

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Reconstructing the Semiconductor Value Chain under AI: A Design-Manufacturing Comparison

Authors
Zhenyu Xu1, *
1School of Business, Guilin University of Electronic Technology, Guilin, Guangxi, China
*Corresponding author. Email: KaguraSuika@mails.guet.edu.cn
Corresponding Author
Zhenyu Xu
Available Online 3 November 2025.
DOI
10.2991/978-94-6463-874-5_72How to use a DOI?
Keywords
Artificial Intelligence; Semiconductor; Profit Model; Vector Autoregression; Impulse Response Function Analysis
Abstract

The emergence of artificial intelligence as a transformative general-purpose technology is reshaping industries worldwide, with the semiconductor sector standing at the core of this evolution. As AI applications grow rapidly, particularly those requiring massive computing power, the semiconductor industry faces significant structural and strategic shifts. While much attention has been paid to technological innovations, few studies have examined how this wave of AI-driven demand is impacting different segments of the semiconductor value chain. This article takes NVIDIA on the design side and TSMC on the manufacturing side as the research objects, and analyzes the changes in their financial performance and profit models during the outbreak of AI computing power from 2019 to 2024. Research finds that generative AI has led to a sharp increase in computing power demand. In the relevant business, the design part has witnessed a significant increase in both revenue and profit margins. Manufacturing part can also benefit from generative AI, but the benefits are not immediate and there is a time lag. The significance of this research lies in breaking through the traditional patterns or scopes, providing guidance in formulating strategies and relevant policies, and offering a standard example to other similar cross - field studies.

Copyright
© 2025 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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Volume Title
Proceedings of the 2025 International Conference on Financial Innovation and Marketing Management (FIMM 2025)
Series
Advances in Economics, Business and Management Research
Publication Date
3 November 2025
ISBN
978-94-6463-874-5
ISSN
2352-5428
DOI
10.2991/978-94-6463-874-5_72How to use a DOI?
Copyright
© 2025 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

Cite this article

risenwbib
TY  - CONF
AU  - Zhenyu Xu
PY  - 2025
DA  - 2025/11/03
TI  - Reconstructing the Semiconductor Value Chain under AI: A Design-Manufacturing Comparison
BT  - Proceedings of the 2025 International Conference on Financial Innovation and Marketing Management (FIMM 2025)
PB  - Atlantis Press
SP  - 623
EP  - 631
SN  - 2352-5428
UR  - https://doi.org/10.2991/978-94-6463-874-5_72
DO  - 10.2991/978-94-6463-874-5_72
ID  - Xu2025
ER  -